Normal view MARC view ISBD view

Materials for Electronic Packaging

CHUNG, Deborach D.L.

Materials for Electronic Packaging - Boston. Butterworth -Heinemann pub. 1995 - xiv,368p.

ISBN: 750693142

Dewey Class. No.: 621.381046

Print
Add to your cart (remove)
Suggest for purchase
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)